PROJECT

Projects

Summary of Investment Information

Project Number

52231

Company Name

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Date SPI Disclosed

Jul 7, 2026

Country

India

Region

South Asia

Projected Board Date

Jun 5, 2026

Environmental Category

B - Limited

Status

Active

Last Updated Date

Jul 7, 2026

Department

Regional Industry - MAS Asia & Pac

Industry

other

Previous Events

Approved : Jun 5, 2026
Signed : Jun 12, 2026
Invested : Jun 23, 2026

Sector

other

Project Description

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S or the Company) is a leading global manufacturer of High-Density Interconnect (HDI) Printed Circuit Boards (PCBs) and Integrated Circuit (IC) substrates, which are critical components in modern devices and applications.

The proposed IFC investment consists of subscription by IFC for an amount of €15 million (approximately US$17.5 million equivalent) to convertible perpetual bonds issued by AT&S. The proceeds of IFC’s investment will be earmarked for financing the capital expenditure and associated working capital requirements for expansion of: (i) PCB manufacturing capacity in Nanjangud, Karnataka, India; and (ii) IC substrates capacity in Kulim, Kedah, Malaysia (the “Project”).

Sponsor / Cost / Location

Development Impact

E&S Category Rationale / Risks and Mitigation