PROJECT

Projects

Environmental & Social Review Summary

Project Number

29318

Company Name

LATTICEPOWER CORPORATION

Date ESRS Disclosed

Aug 26, 2010

Country

China

Region

East Asia and the Pacific

Last Updated Date

Nov 30, 2016

Environmental Category

B - Limited

Status

Completed

Previous Events

Approved : Nov 16, 2010
Signed : Nov 24, 2010
Invested : Dec 8, 2010

Sector

Other Miscellaneous Fabricated Metal Products (Including Non-Wood Housing Products, Tanks, Cutlery, Kitchen Utensils and Handtools, etc.)

Industry

Manufacturing

Department

Regional Industry - MAS Asia & Pac

Project Description

Lattice Power is a growing manufacturer of high brightness light emitting diodes (“LEDs”) chips that can be used in efficient liquid crystal display (“LCD”) screens, notebooks, televisions, monitors and applications in the automotive sector as well as for energy efficient lighting. IFC is considering an investment of up to $ 20 million to support its business expansion related to the manufacturing of LED chips in China.

Overview of IFC's Scope of Review

The scope of review of Lattice Power's (“the Company’s”) compliance with IFC’s Performance Standards and local environmental, social and occupational health and safety standards comprised: (1) assessment of effectiveness of the Company’s environmental and social management system and (2) its ability to ensure and monitor compliance with regulatory requirements and IFC’s Performance Standards in its operations. The review relied on documents and reports made available by Lattice Power, and interviews conducted by IFC staff during their site visits to the Company's offices and system integration/ manufacturing operations in Nanchang, China. During the visit IFC staff conducted interviews with key management personnel, supervisors, EH&S staff and Human Resources, as well as various support staff.

E & S Project Categorization and Applicable Standard

Environmental and Social Mitigation Measures

Stakeholder Engagement

Client Documentation

File Name Actions
ESAP.pdf